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An experimental technique for full package inductance matrix characterization

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2 Author(s)
Chi-Taou Tsai ; Adv. Package Design & Automation Center, Motorola Inc., Chandler, AZ, USA ; Wai-Yeung Yip

A new experimental technique based on a network analyzer was developed for characterizing the full inductance matrices (both self and mutual inductance) of package/interconnect structures. This frequency-domain based measurement technique, including its formulation and procedure, is discussed in this paper. A total of four packages, an 120QFP, a 400TAB, a 313PBGA, and an Alloy 42 132CQFP were selected for the self/mutual L characterization. The measurement results are compared to those obtained by using a time domain reflectometer (TDR)-based technique as well as with the modeling data calculated by 3-D EM tools

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 2 )