By Topic

Surface-mount plastic packages-an assessment of their thermal performance

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Mahalingam, M. ; Motorola Inc., Phoenix, AZ, USA

The characteristics of surface mount (SM) plastic packages such as SOICs (small outline ICs) PLCCs (plastic leaded chip carriers), and FPPLCCs (fine pitch PLCCs) used in IC packaging are described. Experimental data are reported on single-component packages in free air, forced air, and liquid immersion cooling environments. Parameters of a model to help a system thermal designer to best utilize the single-component thermal data are discussed. The influence of both the package variables (such as leadframe design, chip size, and heat spreader) and user variables (such as PC board material, board level package density, and cooling mode) on the package thermal performance is assessed. Opportunities to enhance the SM plastic packages' thermal performance are identified, and their prospects are assessed

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:12 ,  Issue: 4 )