By Topic

Effect of temperature on electrical conduction of carbon-black-filled polyimide

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Gupta, T.K. ; Dept. of Electr. Eng., Tufts Univ., Medford, MA, USA

A study of the stability of two types of carbon resistive paste based on polyimide is reported. Experiments on electrical properties of these thick-film resistors at elevated temperatures are recorded, and the electrical conduction mechanism in thick-film resistors is demonstrated. The conduction mechanism follows closely the model proposed by V. Ambegoekar et al. (1971), while the curing mechanism agrees well with that suggested by N.F. Mott and E.A. Davis (1971). Some of the observed phenomena have been explained on the basis of disordered solids that have many carriers with low electron mobility. The apparently anomalous temperature coefficient of resistance versus temperature behavior finds an immediate explanation in the disordered-system model

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:12 ,  Issue: 4 )