By Topic

Dynamic characterization of surface-mount component leads for solder joint inspection

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Lau, J.H. ; Hewlett-Packard Lab., Palo Alto, CA, USA ; Keely, C.A.

Vibration frequencies of soldered and unsoldered leads of surface-mount wide and narrow small outline integrated circuits (SOICs), plastic leaded chip carriers (PLCCs), and plastic quad flat packs (PQFPs) are calculated using the finite-element method. The corresponding mode shapes of the leads and solder joints are also provided for a better understanding of their dynamic characteristics. It is found that the fundamental frequencies of all the soldered leads are at least five times larger than those of the unsoldered leads. A laser Doppler vibrometer method is developed to measure the frequency of soldered and unsoldered leads of these four surface-mount components. Experiments and theory are in close agreement. The results presented should be useful for theoretically determining the reliability of solder joints under shock and vibration conditions, and for developing a solder joint inspection system for use in a controlled manufacturing process

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:12 ,  Issue: 4 )