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Guidelines for high-performance electronic package interconnections-a simple approach

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2 Author(s)
Yaochao Yang ; Center for Electron. Packaging Res., Arizona Univ., Tucson, AZ, USA ; Brews, J.R.

Guidelines are introduced for designing high-performance interconnections in high-density electronic packages. Three electrical constraints (namely a transient response requirement of the system, an undershoot requirement at the load end of the driven line, and a crosstalk requirement at the load end of the quiet line) relate the design parameters. A simple design algorithm is discussed that relates design parameters. This method is valid for small-capacitive-loads, low-loss lines, and loosely-coupled lines. Ranges for parameters are specified within which the approach is valid. Design curves are presented for this simplified design method. To increase packaging density line cross sections and spacings must be reduced. As a result line loss and line coupling increase. The simple design guidelines presented here show that these trends need not jeopardize circuit performance if s/h⩾0.8 with CL⩽0.3 and rD⩾0.45. For systems with parameters outside these ranges, other approaches are needed

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )

Date of Publication:

Feb 1996

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