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Development of ultra-compact plastic-packaged high-isolation GaAs SPDT switch

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7 Author(s)
Uda, H. ; Microelectron. Res. Center, Sanyo Electr. Co. Ltd., Osaka, Japan ; Hirai, T. ; Tominaga, H. ; Nogawa, K.
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A high-isolation switch IC with 31 dB isolation and 0.88 dB insertion loss at 1.65 GHz, sealed in a six-pin ultra-compact plastic package with approximately 1/4 of the conventional area, was developed for the first time. Analysis using electromagnetic-field simulation of the isolation characteristics between lead pins of the ultra-compact package and a new design method (which takes into account deterioration of the isolation characteristics due to the plastic molding) were used for this IC. Layout design using electromagnetic-field simulation also attempted to minimize chip size

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )

Date of Publication:

Feb 1996

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