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This paper describes the yield enhancement strategies used in the startup of Motorola's MOS 12 fab, with the goal of establishing production capability in minimum time. This goal was achieved by implementing process qualification with real time in-line defect monitoring using a well characterized memory product. Wafer inspection and troubleshooting were facilitated by the acquisition of patterned wafer inspection tools employing several different defect detection technologies: pattern analysis, optical pattern filtering, and light scattering. The considerations for equipment startup are discussed, with emphasis on in-line inspection strategy and data analysis tools.