The strict demands for wafer cleanliness and impurity elimination outlined in the Semiconductor Industry Association's Technology Roadmap require that new monitoring methods be developed for measurement of oxide contamination. A newly available technology is presented here that will help manufacturers achieve the goals of oxide contamination monitoring and feedforward control. The technique is based on the principles of capacitance-voltage (C-V) monitoring, but the measurements are performed in a noncontacting fashion, thus greatly speeding the return of information to the user.
Published in:
Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
Date of Conference: 13-15 Nov 1995