Cart (Loading....) | Create Account
Close category search window
 

Dependence of Flip Chip Solder Reliability on Filler Settling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Cheng-fu Chen ; Dept. of Mech. Eng., Univ. of Alaska, Fairbanks, AK, USA ; Karulkar, P.C.

Thermomechanical reliability of solder joints in flip-chip packages is usually analyzed by assuming a homogeneous underfill ignoring the settling of filler particles. However, filler settling does impact flip chip reliability. This paper reports a numerical study of the influence of filler settling on the fatigue estimation of flip-chip solder joints. In total, nine underfill materials ( 35 vol% silica filler in three epoxies with three filler settling profiles for each epoxy) are individually introduced in a 2-D finite element (FE) model to compare the thermal response of flip chip solder joints that are surrounded by the underfill. The results show that the fatigue indicators for the solder joints (inelastic shear strain increments and inelastic shear strain energy density) corresponding to a gradual, nonuniform filler profile studied in this paper can be smaller than those associated with the uniform filler profile, suggesting that certain gradual filler settling profiles in conjunction with certain resin grades may favor a longer solder fatigue lifetime. The origin of this intriguing observation is in the fact that the solder fatigue indicators are a function of the thermal mismatch among the die, substrate, solder, and underfill materials. The thermal mechanics interplayed among these materials along with a gradual filler profile may allow for minimizing thermal mismatch; and thus lead to lower fatigue indicators.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:32 ,  Issue: 4 )

Date of Publication:

Nov. 2009

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.