By Topic

Microelectronic transducers for heat-power engineering

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Gridchin, V.A. ; Dept. of Semicond. Devices & Microelectron., Novosibirsk State Tech. Univ., Novosibirsk ; Lubibsky, V.M. ; Lobach, O.V.

The problems of measurement of flow rate fluids (gas or liquid) or heat leakage has a great importance for heat power engineering and civil engineering. A variety of methods and transducers has been developed for the solution of these problems. For the measurement of the flow rate the ultrasound, heat, electromagnetic and mechanical methods and transducers are using. For the control of heat losses the thermal electronic transducers are using as well. At present the especial attention attracts the transducers fabricated on the base of microsystem technology due to high sensitivity, small sizes and cheapness. However, using of such transducers is usually limited by the upper boundary of the range of work temperatures of the silicon devices (120...130degC). In this report the microsystem technology is used for the building of the gas and liquid flow rate meters and heat flux meters working up to the temperature of 250degC.

Published in:

Strategic Technology, 2007. IFOST 2007. International Forum on

Date of Conference:

3-6 Oct. 2007