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Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks

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3 Author(s)
Sharma, R. ; Jaypee Univ. of Inf. Technol., Solan ; Chakravarty, T. ; Bhattacharyya, A.B.

In this paper, we present analytical models for line impedance and the coupling coefficient in the presence of additional ground tracks. We use a variational analysis combined with the transverse transmission-line technique to model interconnect lines guarded by ground tracks. Using the proposed model, it would be possible for designers to reduce crosstalk in coupled lines and obtain desired line impedance, thereby ensuring optimum signal integrity. The results obtained are verified by full-wave simulations and measurements performed on a vector network analyzer. The proposed model may find applications in the design and analysis of high-speed interconnects.

Published in:

Electromagnetic Compatibility, IEEE Transactions on  (Volume:51 ,  Issue: 1 )