Referenced Items are not available for this document.
An inspection process based on scanned-beam X-ray laminography (SBXLAM) is proposed herein for quantitatively monitoring the quality of ball-grid-array (BGA) joints. The long-term reliability of the BGA joints depends on the component-assembly process producing joints with sufficient solder volume and proper alignment. Inspection algorithms were developed to measure the critical BGA-joint characteristics, including the alignment between the ball and the PCB pad, the solder thickness, and the average joint-diameter, and thus, determine whether the joints are defective. The performance of the inspection algorithms was evaluated by inspecting samples with defects that were independently verified
Published in:
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
(Volume:18
,
Issue:
4
)
Date of Publication: Dec 1995
- Page(s):
- 851 - 861
- ISSN :
- 1070-9886
- INSPEC Accession Number:
- 5163464
- Digital Object Identifier :
- 10.1109/95.477473
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec 1995
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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