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Alumina derivative ceramics and low temperature co-fired ceramic (LTCC) electronic multichip module (MCM) packaging substrates have been characterized using single- and double-sided inspection laser flash thermal diffusivity measurement techniques. The paper highlights problems associated with both the measurement system and associated data analysis for the single-sided measurement, and these data are evaluated with reference to that measured by an existing (double sided inspection) standard laser flash method. Finally, a preliminary single-sided measurement methodology is proposed.
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on (Volume:18 , Issue: 4 )
Date of Publication: Dec. 1995