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Analysis of a thermally enhanced ball grid array package

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3 Author(s)
Guenin, B.M. ; Adv. Products Operation, Amkor Electron. Inc., Chandler, AZ, USA ; Marrs, R.C. ; Molnarr, R.J.

A thermally enhanced ball grid array package (SuperBGA package) has been developed. Its thermal performance has been analyzed using a nonlinear, lumped parameter model. This model uses a temperature-dependent heat transfer coefficient which accounts for the natural, mixed, and forced convection regimes and radiative heat transfer. The accuracy of the model is verified experimentally using one package size. The model is then used to predict the thermal performance of other package sizes and to rationalize the high level of thermal performance exhibited by the package

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 4 )

Date of Publication:

Dec 1995

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