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Sensor based registration and stacking of electronic substrate layers

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4 Author(s)
Brennemann, A.E. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; Hammer, R. ; Jecusco, W.V., III ; Hollis, R.L.

This sensor-based approach for registration and stacking of electronic substrate sublaminates replaces pin-in-slot methods, yet does not require accurate automation equipment. Tests of a pilot workcell for this approach showed that the contact holes were consistently aligned to 2.5 μm (3/spl sigma/), more than ten times better than the traditional mechanical method.

Published in:

Robotics & Automation Magazine, IEEE  (Volume:2 ,  Issue: 4 )