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Crosstalk and Switching Noise Mechanism Study in High Density Wire-bond FPGA Device

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3 Author(s)
Siow Chek Tan ; Altera Corporation (M) Sdn Bhd, Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900, Penang, Malaysia, ; Yee Huan Yew ; Hong Shi

This paper presents the dominant contributors of mutual inductance in wire-bond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package in low cost application.

Published in:

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Date of Conference:

9-12 Dec. 2008