Skip to Main Content
The electronic industry has a growing need for efficient heat dissipation mechanisms such as micro heat exchanger systems. This active cooling approach requires the integration of microfluidic components near the main heat sources of the electronic devices. Despite the investigation of several micro-cooling configurations, their commercial utilization by the electronic industry is rather limited due to complex fabrication and integration methods. Here, we present the integration of cylindrical microchannels fabricated by direct-write assembly in printed circuit board layouts for a micro heat exchanger application. The thermal performance of the manufactured prototype was characterized with respect to the fluid flow rate. The original fabrication and integration approaches presented here show high potential for efficient, compact, and low-cost micro heat exchangers for the electronic industry.
Components and Packaging Technologies, IEEE Transactions on (Volume:31 , Issue: 4 )
Date of Publication: Dec. 2008