Referenced Items are not available for this document.
This paper describes about III-V integration on silicon and summarizes the recent progress on the research efforts to combine the merits of III-V and silicon, on the same silicon wafer, for future high-speed and low-power nanoelectronics. The successful integration of III-V on silicon can open up opportunities for integrating new functionalities and features on silicon, such as integrating logic, optoelectronic and communication platforms on the same Si wafer.
Published in:
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Date of Conference: 12-15 Oct. 2008
- Page(s):
- 1 - 2
- ISSN :
- 1550-8781
- E-ISBN :
- 978-1-4244-1940-1
- Print ISBN:
- 978-1-4244-1939-5
- INSPEC Accession Number:
- 10323598
- Conference Location :
- Monterey, CA
- Digital Object Identifier :
- 10.1109/CSICS.2008.8
- Product Type:
- Conference Publications
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