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Integrating III-V on Silicon for Future Nanoelectronics

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2 Author(s)
Hudait, Mantu K. ; Technol. & Manuf. Group, Intel Corp., Hillsboro, OR ; Chau, R.

This paper describes about III-V integration on silicon and summarizes the recent progress on the research efforts to combine the merits of III-V and silicon, on the same silicon wafer, for future high-speed and low-power nanoelectronics. The successful integration of III-V on silicon can open up opportunities for integrating new functionalities and features on silicon, such as integrating logic, optoelectronic and communication platforms on the same Si wafer.

Published in:

Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE

Date of Conference:

12-15 Oct. 2008