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Integrated thermal modeling of heterogeneous eCubes stacked devices

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4 Author(s)
G. Janczyk ; Institute of Electron Technology Al. Lotnikow 32/46 02-668, Warsaw, POLAND ; T. Bieniek ; P. Grabiec ; J. Szynka

Vertical chip integration applied in heterogeneous systems is a design approach used to extend the device functionality and improve its performance. Apart from the design advancements, thermal budget of the device is constrained internal structure of the device. Internal module components limit the efficiency of device cooling. It is one of the most important concerns of vertical integration reliability. Development of vertically integrated devices requires cooperation of different partners and designers. This paper presents thermo-mechanical simulation needs and capabilities. The presented HDL approach is used for thermal modeling of the structure and high level, NDA-proof thermal simulations of modules of stacked, heterogeneous devices.

Published in:

Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on

Date of Conference:

24-26 Sept. 2008