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Large Package Transfer Molded DIP-IPM

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7 Author(s)

This paper presents a new larger version of the dual in-line package transfer molded Intelligent Power Module (DIP-IPM) developed by Mitsubishi Electric for home appliance motor control. The new large DIP-IPM utilizes a high thermal conductivity insulating resin sheet and an integrated aluminum heat spreader to provide the reduced thermal impedance and mechanical integrity required for a higher power applications. Using this approach the range DIP-IPM ratings has now been extended to 75 A at 600 V and 35 A at 1200 V. Like the lower power DIP-IPMs the new large DIP has high voltage integrated circuit (HVIC) based level shifting gate drive with short circuit protection and under voltage lock-out. However, in order to avoid the need for an excessively large current sensing resistor the new DIP uses IGBT chips with a current mirror emitter that produces a low level current proportional to the main emitter current for short circuit detection. In addition, the new DIP-IPM also provides an analog feedback signal proportional the module's temperature.

Published in:

Industry Applications Society Annual Meeting, 2008. IAS '08. IEEE

Date of Conference:

5-9 Oct. 2008