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Low-cost multichip modules

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4 Author(s)
Dobers, M. ; Blaupunkt-Werke GmbH, Hildesheim, Germany ; Seyffert, M. ; Hauschild, F.D. ; Czaya, C.-P.

We developed a new type of laminate-based multichip module, the interface of which to the next higher system level is a ball grid array. The modules contain both integrated circuits and passive components like chip capacitors and resistors. The protection of the IC's is offered by a plastic cap which is glued to the substrate. We consider conceptional questions, the construction of the modules, and the actual status of qualification

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 3 )