By Topic

Characterization of Equalized and Repeated Interconnects for NoC Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Byungsub Kim ; Massachusetts Institute of Technology ; Vladimir Stojanović

As the number of cores increases and onand off-chip bandwidth demand rises, it is becoming increasingly more difficult to rely on conventional interconnects and remain within the chip power budget. This article explores leveraging equalization for global and semi-global long interconnects to overcome this problem.

Published in:

IEEE Design & Test of Computers  (Volume:25 ,  Issue: 5 )