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FMEA of System-in-Package (SiP) -based Tire Pressure Monitoring System

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4 Author(s)
Man-Lung Sham ; Advanced Packaging Technologies, Material and Packaging Technologies, Hong Kong Applied Science & Technology Research Institute (ASTRI), Hong Kong Science Park, Shatin, China ; Tung-Chin Lui ; Ziyang Gao ; Tom Chung

For transferring R&D efforts into real product manufacturing, proper product reliability qualification is one of the most critical considerations during product development in addition to assembly yield prediction. It is particularly important for automotive electronics because the operating conditions are extremely harsh (e.g. -20degC ~ 105degC) and a number of applications are even related to human safety. Failure mode and effects analysis (FMEA) of SiP-based tire pressure monitoring system (TPMS) is selected in this paper as an illustration of the process for transferring R&D efforts into real product. FMEA is proven as a useful tool in the early design stage to identify any potential design and/or process-related failure modes, corresponding effects, root causes followed by corrective actions. Better quality and reliability, shorter system development time and cost, as well as early identification and elimination of potential failure modes can therefore be achieved. In addition, numerical analysis was performed during the course of FMEA in order to address the potential risks and therefore to provide proper recommendations.

Published in:

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Date of Conference:

28-31 July 2008