Referenced Items are not available for this document.
Organic electronic materials are proposed to be used as a tamper protection grid for hardware security modules. Methods of designing a protection grid likely to be damaged in currently published depackaging techniques are derived. Organic protection layers are shown to be a feasible method of protecting hardware security modules against tampering.
Published in:
Bio-inspired Learning and Intelligent Systems for Security, 2008. BLISS '08. ECSIS Symposium on
Date of Conference: 4-6 Aug. 2008
- Page(s):
- 92 - 96
- Print ISBN:
- 978-0-7695-3265-3
- INSPEC Accession Number:
- 10131644
- Conference Location :
- Edinburgh
- Digital Object Identifier :
- 10.1109/BLISS.2008.27
- Product Type:
- Conference Publications
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