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A 300-mm Semiconductor Manufacturing Foreign Material Reduction Initiative

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6 Author(s)
Long, C.W. ; Res. Div., IBM, Essex Junction, VT ; Sienkiewicz, T. ; Pfeiffer, G. ; Guse, M.
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It is well established that foreign material (FM) in a semiconductor manufacturing process can result in significant unplanned tool down time, reduced product yields, and potential reliability performance issues. This paper will present an overview of the strategy and subsequent results of a multifaceted effort to reduce FM impact during the ramp up of the IBM 300-mm semiconductor manufacturing facility in Hopewell Junction, NY.

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Semiconductor Manufacturing, IEEE Transactions on  (Volume:21 ,  Issue: 3 )