By Topic

A Digital-Microfluidic Approach to Chip Cooling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)

Thermal management has emerged as an increasingly important aspect of IC design. Elevated die temperatures are detrimental to circuit performance and reliability. Furthermore, hot spots due to spatially nonuniform heat flux in ICs can cause physical stress that further reduces reliability. The authors of this article review various chip-cooling techniques that have been proposed in the literature. They then present an alternative approach based on a recently invented digital-microfluidic platform that enables an adaptive cooling technique. This novel digital-fluid-handling platform uses a phenomenon known as electrowetting so that a vast array of discrete droplets of liquid, ranging from microliters to nanoliters and potentially to picoliters, can be independently moved along a substrate. Although this technology was originally developed for a biological and chemical lab on a chip, the authors show how it can be adapted for use as a fully reconfigurable, adaptive cooling platform.

Published in:

IEEE Design & Test of Computers  (Volume:25 ,  Issue: 4 )