Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages

The general tendency of the portable handheld electronic is to integrate more and more functionalities (phone, audio, video, internet, wireless connections, etc.) in a size that is smaller and smaller (thinner devices per example). Thus, electronic components with a great level of miniaturization are needed, like Wafer Level Chip Scale Packages (WL-CSP), to answer the market demand.