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Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects

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3 Author(s)
Maffucci, A. ; DAEIMI, Univ. di Cassino, Cassino ; Miano, G. ; Villone, F.

This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip.

Published in:

Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on

Date of Conference:

13-16 May 2007

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