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Development of Stretch Solder Interconnections for Wafer Level Packaging

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8 Author(s)
Rajoo, R. ; Inst. of Microelectron., Singapore ; Lim, S.S. ; Wong, E.H. ; Hnin, W.Y.
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A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:31 ,  Issue: 2 )

Date of Publication:

May 2008

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