By Topic

Cavity Size Effects on the Performance of Superstrate Folded Dipole Antennas for 60 GHz Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Duixian Liu ; T. J. Watson Res. Center, IBM, Yorktown Heights, NY

This paper describes a cost-effective approach for an off-chip antenna design and construction that would show the potential for its integration with a 60 GHz SiGe chipset, in a low-cost plastic chip-scale packaging technology or silicon carrier based wafer-scale packaging technology. Obtaining the maximum bandwidth-gain product within a given design constrain is the basic challenge for the design of printed planar antennas. An approach that combines a fused-silica superstrate and an air substrate suitable for flip-chip attachment and packaging are presented, where the antenna is printed on the bottom side of the substrate and suspended in air over the reflecting ground. This solution results in a wide bandwidth of more than 30% and an antenna efficiency of over 90%. The model to hardware correlation is very good, but both show that there exists a gain dip around 60 GHz frequency.

Published in:

Antenna Technology: Small Antennas and Novel Metamaterials, 2008. iWAT 2008. International Workshop on

Date of Conference:

4-6 March 2008