By Topic

Evaluation of Different Die Attach Film and Epoxy Pastes for Stacked Die QFN Package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Ibrahim Ahmad ; Advanced Semiconductor Packaging Research Group (ASPAC), Faculty of Engineering, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor, Malaysia ; Nur Nadia Bachok ; Ng Cheong Chiang ; Meor Zainal Meor Talib
more authors

The trend in the semiconductor industry is to develop more powerful components while decreasing the component size. A suitable material set has to be obtained for the required reliability performance. The objective of this study is to evaluate the performance of different die attach film (DAF) and epoxy pastes for stacked die quad flat no-lead package. Both experimental and modeling works are resorted to analyze and refine the package design. Six combinations of die attach materials are evaluated to compare with current single die package. The strengths and weaknesses of the DAF and epoxy paste are compared in this paper. Die shear test is performed to study the adhesion condition between the die attach material and silicon die. Finite element model of the package is generated to determine the thermally induced stresses under different conditions. All the results show that it is robust to use the new epoxy paste and DAF.

Published in:

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Date of Conference:

10-12 Dec. 2007