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Advancement of Multifunctional support structure technologies (AMFSST)

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4 Author(s)
R. John ; HTS GmbH Am Glaswerk 6 D-01640 Coswig Germany ; G. Atxaga ; H. J. Frerker ; A. Newerla

The multifunctional support structure (MFSS) technology is promising a reduction of overall mass and packing volume for spacecraft (S/C) electronic components. This technology eliminates the electronic box chassis and the cabling between the boxes by integrating the electronics, thermal control and the structural support into one single element The ultimate goal of the MFSS technology is to reduce size, weight, power consumption, cost and production time for future spacecraft components. The paper focus on the main challenges and solutions related to the thermal management within the MFSS technology based on the selected charge regulator (CR) application. Starting with the main set of thermal requirements for the CR the paper will include: Conceptual and detailed design based on high-conductivity carbon fibre CFRP, Description and results of the thermal material sample test program, Parameter and results for the performed first thermal simulation

Published in:

Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on

Date of Conference:

17-19 Sept. 2007