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Multilayer Hybrid Circuit Technology

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3 Author(s)
Flick, S. ; Heraeus TFD, Hanau ; Qingsheng Luo ; Klein, R.

The technology that multilayer hybrid circuits use dielectric layer to insulate stacked conduct has been applied many years, but it is limited by the layers and product yield. This paper introduces a newly dielectric paste of Heraeus, recommend several material systems for multilayer hybrid application. Provide comprehensive data based on experiment in migration stability, laser trimming, adhesion, wire bonding reliability and compatibility. This technology would meet hybrid company demands necessary in multilayer hybrid design, manufacturing process, and product reliability. There is a great benefit for existing thick film technology in both commercial and reliability products application.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007