Referenced Items are not available for this document.
In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.
Published in:
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Date of Conference: 14-17 Aug. 2007
- Page(s):
- 1 - 2
- E-ISBN :
- 978-1-4244-1392-8
- Print ISBN:
- 978-1-4244-1392-8
- INSPEC Accession Number:
- 9860134
- Conference Location :
- Shanghai
- Digital Object Identifier :
- 10.1109/ICEPT.2007.4441388
- Product Type:
- Conference Publications
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