By Topic

The Effect of Cavities and Channels on the Strength of LTCC Substrate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yang-Fei Zhang ; Peking Univ., Beijing ; Min Miao ; Shu-Lin Bai ; Yu-Feng Jin

The effect of cavities and channels on the strength of LTCC substrate has been investigated by finite element analysis with commercial software ANSYS. The simulation model is based on three-point bending test of thick film LTCC substrate. Axial tensile stress and shear stress among layers are characterized to describe the effect on flexural strength and inter-layer shear strength. X, Y-axial channels, Z-axial via-hole, and cavities of various amounts are formed in the middle or surface layers of the LTCC substrate. The simulation results show that the maximum tensile stress always appears on the midline of the substrate bottom and causes fracture. The shear stress concentration has been found on the sidewalls of the holes and cavities and enhances the interlayer stripping.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007