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Research Progress on Electrochemical Deposition in Electronic Packaging

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4 Author(s)
Dong-sheng Zhu ; South China Univ. of Technol., Guangzhou ; Jun-xi Lei ; Chang-hong Wang ; Hanying Hu

The printed circuit board (PCB) technology is developing in the aspect of small size, lightweight, high density and high stability, so it makes strict requirement to the electrochemical deposition technology in the PCB manufacturing. This paper shows the mechanism of electrochemical deposition in the PCB manufacturing in detail, including the electroless plating technology and the electroplating technology, briefly introduces the process of PCB manufacturing with the combination of this two kinds of technology, introduces the development and research progress of electroless plating technology and electroplating technology in detail, proposes some problems in electrochemical deposition process, finally introduces some improvements of electrochemical deposition in the aspect of the stability of plating solution, the composition of plating solution and some practical advanced technique.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007