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LF55GN photosensitive flexopolymer as a new material for ultra-thick and high aspect-ratio MEMS fabrication

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3 Author(s)
Sayah, A. ; Ecole Polytech. Fed. de Lausanne, Lausanne ; Parashar, V.K. ; Gijs, M.A.M.

We present the photosensitive flexopolymer LF55GN as a new material for the realisation of thick three-dimensional microstructures. The latter can be realised with a thickness up to 4 millimetres and with an aspect ratio of 10 using only a single UV exposure step. LF55GN is a unique material that allows fabricating thick components of optical quality that easily absorb stress due to the elastic nature of the material.

Published in:

Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on

Date of Conference:

21-25 Jan. 2007