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Computational Approach for Reliable and Robust System-in-Package Design

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4 Author(s)
Stoyan Stoyanov ; School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, Greenwich, London SE10 9LS, UK. E-mail: Phone: +44 (0)20 8331 8520 Fax: +44 (0)20 8331 8665 ; Chris Bailey ; Nadia Strusevich ; Jean-Marc Yannou

A computational modelling approach integrated with optimisation and statistical methods that can aid the development of reliable and robust electronic packages and systems is presented. The design for reliability methodology is demonstrated for the design of a SiP structure. In this study the focus is on the procedure for representing the uncertainties in the package design parameters, their impact on reliability and robustness of the package design and how these can be included in the design optimisation modelling framework. The analysis of thermo-mechanical behaviour of the package is conducted using non-linear transient finite element simulations. Key system responses of interest, the fatigue life-time of the lead-free solder interconnects and warpage of the package, are predicted and used subsequently for design purposes. The design tasks are to identify the optimal SiP designs by varying several package input parameters so that the reliability and the robustness of the package are improved and in the same time specified performance criteria are also satisfied.

Published in:

2007 30th International Spring Seminar on Electronics Technology (ISSE)

Date of Conference:

9-13 May 2007