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This work outlines experimental and simulation studies employing carbon nanotubes (CNT) for electronics applications as adhesive joining element. For the experiments the carbon nanotubes are used as filler in an epoxy-matrix. The weight percentage of the filler was varied between 6.5 wt.-%, 8.1 wt.-% and 18.9 wt.-%. These composites are used as adhesives on a test board for electronics packaging. In addition the carbon nanotubes/epoxy composites are compared to common adhesives for electronics applications. The experiments are focused on the electrical and mechanical characterization of these adhesives. Subsequently a simulation-tool supports the experimental results of the carbon nanotubes composites. The simulation-tool calculates the contact resistance of one adhesive connection. The tool varies the carbon nanotubes percentage of the composite. Also it is possible to diversify the percentage of the conductive nanotubes because it is well known manufacturing carbon nanotubes only 1/3 of the tubes are metallic conductive. The attempt is to simulate one joining element and compared it with the results of the investigations of the carbon nanotube composites. This study shows a possibility to establish new material for future application to solve the challenges of future electronics packaging.