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In this paper, we exploit the 3D-capability of the method to refine simulator resolution to the different material layers of an IC. We have designed and had fabricated ICs with built-in heaters and a temperature sensor array. We use measurement results from these ICs to calibrate our simulator, and investigate the effectiveness of horizontal metal networks and vertical thermal via structures, which have been suggested for the cooling of 3D ICs. We also study the latter method for controlled, localized chip heating.