By Topic

Hygro-thermal Finite Element Analysis of Green Stacked Die Package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Z K Hua ; Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Education, The School of Mechanical & Electronic Engineering and Automation, Shanghai University, Shanghai, 200072, China ; C Y Li ; J H Zhang ; Y X Luo
more authors

3D stacked die packages are especially common today. With thinner chip and multi-layer, it requires higher reliability of such a package design. Besides this, with the increasing rigid requirements for prohibiting lead (Pb) and also the trend of green electronics, higher reflow temperature is required. All mentioned above pose a challenge towards the development of the stacked die package. And in this paper, the author presents a hygrothermal and analysis of a 4-layer stacked die package, with emphasis on the thermal induced stress and moisture diffusion characteristic. First, according to the JEDEC standard, the moisture diffusion characteristic under different conditions is investigated. Second, the thermal induced stress during reflow time is studied. Results show that the substrate and bottom adhesive endure large thermal stress and strain while have higher moisture diffusion rate. Both of the hazards will reduce the capability of the whole device, even cause the 'popcorn' cracking. Such results also indicate why the reliability of the bottom layers is relatively low in manufacture.

Published in:

Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International

Date of Conference:

3-5 Oct. 2007