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Strengths, Weaknesses, Opportunities and Threats of the Post-Silicon Technologies

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1 Author(s)
Coffa, S. ; STMicroelectron., Catania

The unique characteristics of novel technological platforms, using different substrates, such as SiC, GaN, plastic, and introducing thin film processing of non-conventional materials, e.g. polymers or small organic molecules, offer the promise of widespread application in several areas, ranging from light and robust displays, to low cost photovoltaics, or to flexible radio-frequency identification (RF-ID) circuitry. This talk discusses the challenges launched by the scientific community operating in the field of the post-Si technology, and specifically by STMicroelectronics, to give an impetus for advances in materials and processing development.

Published in:

Advanced Thermal Processing of Semiconductors, 2007. RTP 2007. 15th International Conference on

Date of Conference:

2-5 Oct. 2007

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