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With the evolution of information technology, the frequency applied to electronic devices has become higher to handle the growing volumes of data. Signals on printed wiring boards (PWBs) used in these applications have come to adapt higher frequencies. At higher frequencies signal will attenuate more easily. The important problem in high-frequency circuits is the way to reduce the transmission loss on PWBs. We have developed novel low-transmission-loss multilayer materials suitable for PWBs applied to high GHz bands. The laminates made with new resins have good dielectric properties and show the same level of low dissipation factor as the PTFE laminate. Moreover, they have high Tg, low moisture absorption, and good heat resistance suited for the lead-free soldering process.