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Conductive Adhesives: Alternative to High Temperature Solders and The Future

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1 Author(s)
Katsuaki Suganuma ; Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, e-mail:, phone:+81-6-6879-8520

Isotropic conductive adhesives have excellent attributes as heat-resistant lead-free high temperature interconnection materials as well as those enabling low temperature manufacturing of circuits. Ag metallic particles from nano-scale to micron-scale are combined with organic matrix to provide sound high-temperature lead-free interconnection. Micron-sized Ag particles paste can provide flexible wiring in combination with silicone-based resin. The ultra flexible skin sensor for a robot was successfully fabricated from the newly developed Ag-silicone conductive adhesive. Ag nanoparticle pastes have been successfully adopted to ink-jet wiring and the multilayered circuit layers on a SiP structure with Ag nanopastes demonstrated the potentials of the new printed electronics technology. Lowering process temperature for Ag nanoparticle pastes finally reached room temperature wiring in air atmosphere.

Published in:

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

Date of Conference:

Jan. 16 2007-Yearly 18 2007