By Topic

FBGA Die Crack Issue Analysis

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yuqi Jiang ; Spansion (China) Limited, No.33 Xinghai Street, Suzhou 215021, China. Tel: 86-512-62523333 ext. 36576, Email: ; Xianzhong Song ; Tim Fai Lam ; Surasez Samatitchon

Die crack issue was found for the electrical failure packages. Failure analysis was performed to characterize the crack line pattern and crack origin. Pick-place and testing operations were examined through FEA modeling. By studying the first principle stress distribution and its vector plot, the critical and possible situations were found.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007