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FBGA Die Crack Issue Analysis

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4 Author(s)
Yuqi Jiang ; Spansion (China) Ltd., Suzhou ; Xianzhong Song ; Tim Fai Lam ; Samatitchon, S.

Die crack issue was found for the electrical failure packages. Failure analysis was performed to characterize the crack line pattern and crack origin. Pick-place and testing operations were examined through FEA modeling. By studying the first principle stress distribution and its vector plot, the critical and possible situations were found.

Published in:
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference: 26-28 June 2007

Page(s):
1 - 4
E-ISBN :
1-4244-1253-6
Print ISBN:
1-4244-1253-6
INSPEC Accession Number:
9724504
Conference Location :
Shanghai
Digital Object Identifier :
10.1109/HDP.2007.4283571
Product Type:
Conference Publications

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