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FBGA Die Crack Issue Analysis

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4 Author(s)
Yuqi Jiang ; Spansion (China) Limited, No.33 Xinghai Street, Suzhou 215021, China. Tel: 86-512-62523333 ext. 36576, Email: Richard.jiang@spansion.com ; Xianzhong Song ; Tim Fai Lam ; Surasez Samatitchon

Die crack issue was found for the electrical failure packages. Failure analysis was performed to characterize the crack line pattern and crack origin. Pick-place and testing operations were examined through FEA modeling. By studying the first principle stress distribution and its vector plot, the critical and possible situations were found.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007