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Densification in Electronics Packaging and Assembly

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1 Author(s)
Hua, Fay ; Intel Corp., Santa Clara, CA

Summary form only given. Demand for smaller, faster, and low cost electronics has led the electronics industry move to very fine interconnects on both Ball Grid Array (BGA) surface mount assembly, flip chip packaging level. The trend of densification challenges board assembly material, processes and reliability. HDI PCB materials will become mainstream for electronics to address the increasing I/O density. The electrical, mechanical, thermal and chemical interaction impacts to solder joint reliability needs to be addressed. Low stress flip chip assembly technology will be needed for next generation flip chip technology.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007

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