By Topic

Interconnection Technologies of Anisotropic Conductive Films and Their Application to Flexible Electronics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Matsuda, K. ; Electron. Mater. Bus. Sector, Hitachi Chem. Co., Ltd., Chikusei ; Watanabe, I.

Anisotropic conductive films (ACFs) consist of conducting particles and adhesive resins and have been widely used for packaging technologies in FPDs (Flat Panel Displays) such as LCDs (Liquid Crystal Displays) for last decades. So far various packaging technologies such as TCP (Tape Carrier Package) on LCD panel or PWB (Printed Wiring Board), COF (Chip on flex) on LCD panel or PWB and COG (Chip on Glass) using ACFs have been developed to meet the requirement of fine pitch capability and make the flat panel displays smaller, lighter and thinner. Also ACFs are flip-chip technologies have been of much interest because they provide higher packaging density than conventional semiconductor packaging technologies such as face-up wire bonding. In addition, ACFs are expected as interconnect materials which realize flexible electronics such as flexible display and RFID (Radio Frequency Identification).

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007