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Browse Journals & Magazines > Components and Packaging Tech ...> Volume:30 Issue:2 Help

Development of Ag Alloy Thin Film With Both High Reflectance and Adhesion for High Density Opt-Electronic Module

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7 Author(s)
Kuroda, A. ; Sanyo Electr. Co. Ltd., Osaka ; Satoh, R. ; Iwata, Y. ; Yokota, K.
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We have developed a new multilayered reflection film structure containing Ag films for achieving slab waveguide based optical transmission interconnections between large scale integrated chips for next generation high-speed computers. We applied Cr to both adhere the Ag to the SiO2 optical layer and to inhibit diffusion of Ag into SiO2. Although we found that Cr tends to decrease the reflectance, we found that it is possible to satisfy both adhesiveness and reflectance requirements by adjusting the film thickness

Published in:
Components and Packaging Technologies, IEEE Transactions on  (Volume:30 ,  Issue: 2 )

Date of Publication: June 2007

Page(s):
302 - 308
ISSN :
1521-3331
INSPEC Accession Number:
9501228
Digital Object Identifier :
10.1109/TCAPT.2007.897974
Date of Current Version :
29 May 2007
Issue Date :
June 2007
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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