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A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

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15 Author(s)
Colgan, E.G. ; IBM T. J. Watson Res. Center, Yorktown Heights, NY ; Furman, B. ; Gaynes, M. ; Graham, W.S.
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This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or more

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Components and Packaging Technologies, IEEE Transactions on  (Volume:30 ,  Issue: 2 )