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Prediction of Losses Caused by Roughness of Metallization in Printed-Circuit Boards

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5 Author(s)
Deutsch, A. ; IBM T. J. Watson Res. Center, Yorktown Heights, NY ; Surovic, C.W. ; Krabbenhoft, R.S. ; Kopcsay, G.V.
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In this paper, the effect of metal roughness on the total loss, the extracted tandelta, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, 2-D, causal, broadband modeling methodology is shown

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:30 ,  Issue: 2 )

Date of Publication:

May 2007

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